HSB44-606010P

HSB44-606010P
HSB44-606010P Alternate View

HSB44-606010P

60 x 60 mm, BGA Heat Sink, Aluminum, PCB, Push Pins

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 10.09
Thermal Resistance @ 1 W, nat conv (°C/W) 10.6
Thermal Resistance @ 1 W, 200 LFM (°C/W) 2.7
Thermal Resistance @ 1 W, 400 LFM (°C/W) 1.7
Power Dissipation @ 75°C ΔT, nat conv (W) 7.43
Material AL6063-T5
Material Finish Clean
Dimensions LxWxH (mm) 60 x 60 x 10
Dimensions LxWxH (in) 2.36 x 2.36 x 0.394
Thermal Pad No

Technical Docs

Datasheet

Buy from CUI Devices

Loading...

Shop our distributors

Featured Products

All Heat Sinks Categories