HSB32-232318

HSB32-232318
HSB32-232318 Alternate View

HSB32-232318

23 x 23 mm, BGA Heat Sink, Aluminum, PCB

Datasheet

Specifications

Type Description
Select
Package Cooled Not Applicable
Mounting Style PCB
Thermal Resistance @ 75°C ΔT, nat conv (°C/W) 12.67
Thermal Resistance @ 1 W, nat conv (°C/W) 17.2
Thermal Resistance @ 1 W, 200 LFM (°C/W) 4.4
Thermal Resistance @ 1 W, 400 LFM (°C/W) 2.9
Power Dissipation @ 75°C ΔT, nat conv (W) 5.92
Material AL6063-T5
Material Finish Black Anodized
Dimensions LxWxH (mm) 23 x 23 x 18
Dimensions LxWxH (in) 0.91 x 0.91 x 0.71
Thermal Pad No

Technical Docs

Datasheet

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